Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9250288 | Wafer-level testing method for singulated 3D-stacked chip cubes | Kun-Chih Chan, Shin-Kung CHEN | 2016-02-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9250288 | Wafer-level testing method for singulated 3D-stacked chip cubes | Kun-Chih Chan, Shin-Kung CHEN | 2016-02-02 |