Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431317 | Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package | Hujiao Wang, David A. Holtzclaw, Wei Qi, Benjamin L. Davis, John MacKay | 2016-08-30 |