Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9372214 | High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same | Eric W. Strid, Richard Campbell, Kenneth R. Smith, K. Reed Gleason | 2016-06-21 | $1,812,000 |