Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9487881 | Apparatus for electroplating a tooling for use in semiconductor device encapsulation | Shu Chuen Ho, Kai Fat Yip, Yew Lan Ngo, Saravana Ranganathan Damodaran | 2016-11-08 |