Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281290 | Bond head for thermal compression die bonding | Pak Kin Leung, Cheuk Wah Tang, Chi Ping Hung, Gary Peter Widdowson | 2016-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281290 | Bond head for thermal compression die bonding | Pak Kin Leung, Cheuk Wah Tang, Chi Ping Hung, Gary Peter Widdowson | 2016-03-08 |