Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9306135 | Mold release film and method of process for producing a semiconductor device using the same | Wataru KASAI, Yoshiaki Higuchi, Daisuke TAGUCHI, Satoshi Otsugu | 2016-04-05 |