Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9475694 | Two-axis vertical mount package assembly | Arturo Martizon, Jr. | 2016-10-25 |
| 9407997 | Microphone package with embedded ASIC | Michael D. Delaus, Kathy O'Donnell | 2016-08-02 |
| 9343367 | Integrated device die and package with stress reduction features | Xiaojie Xue | 2016-05-17 |
| 9260293 | Pre-molded MEMS device package with conductive shell | — | 2016-02-16 |
| 9258634 | Microphone system with offset apertures | Jicheng Yang | 2016-02-09 |