Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293440 | Method for interconnecting die and substrate in an electronic package | Michael Holm, Matt Shea | 2016-03-22 |
| 9257355 | Method for embedding a chipset having an intermediary interposer in high density electronic modules | Brian R. Smith | 2016-02-09 |