Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9305878 | Integrated circuits and methods for fabricating integrated circuits with capping layers between metal contacts and interconnects | Torsten Huisinga, Andreas Ott, Axel Preusse | 2016-04-05 |
| 9257329 | Methods for fabricating integrated circuits including densifying interlevel dielectric layers | Oliver Mieth, Torsten Huisinga | 2016-02-09 |