Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281264 | Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same | Meng Ee Lee, Eng Chuan Ong | 2016-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281264 | Electronic packaging substrate with etching indentation as die attachment anchor and method of manufacturing the same | Meng Ee Lee, Eng Chuan Ong | 2016-03-08 |