Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437532 | Substrate for semiconductor package and process for manufacturing | Tien-Szu Chen, Sheng-Ming Wang | 2016-09-06 |
| 9406658 | Embedded component device and manufacturing methods thereof | Yuan-Chang Su, Ming-Chiang Lee, Shih-Fu Huang | 2016-08-02 |