Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431368 | Three dimensional device integration method and integrated device | Paul M. Enquist | 2016-08-30 |
| 9391143 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2016-07-12 |
| 9331149 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2016-05-03 |