Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863759 | Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse | — | 2011-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7863759 | Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse | — | 2011-01-04 |