Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053897 | Production of a carrier wafer contact in trench insulated integrated SOI circuits having high-voltage components | — | 2011-11-08 |
| 7989308 | Creation of dielectrically insulating soi-technlogical trenches comprising rounded edges for allowing higher voltages | Uwe Eckoldt, Thomas Oetzel | 2011-08-02 |
| 7989921 | Soi vertical bipolar power component | — | 2011-08-02 |