Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8085553 | Lead assembly for a flip-chip power switch | Efren M. Lacap | 2011-12-27 |
| 7989953 | Flip chip power switch with under bump metallization stack | Efren M. Lacap | 2011-08-02 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8085553 | Lead assembly for a flip-chip power switch | Efren M. Lacap | 2011-12-27 |
| 7989953 | Flip chip power switch with under bump metallization stack | Efren M. Lacap | 2011-08-02 |