Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915728 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof | Kuang Hann Lin, Chih-Ping Peng | 2011-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915728 | Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof | Kuang Hann Lin, Chih-Ping Peng | 2011-03-29 |