Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932800 | Method and apparatus for three-dimensional integration of embedded power module | Michele H. Lim, J. D. van Wyk | 2011-04-26 |
| 7911792 | Direct dipping cooled power module and packaging | Chingchi Chen, Michael W. Degner | 2011-03-22 |