Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8051560 | Method of fabricating a solder pad structure | Shu-Sheng Chiang | 2011-11-08 |
| 7906200 | Composite circuit substrate structure | Chih-Peng Fan | 2011-03-15 |
| 7867908 | Method of fabricating substrate | Chih-Ming Chang, Cheng-Po Yu, Chung W. Ho | 2011-01-11 |