Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049114 | Package substrate with a cavity, semiconductor package and fabrication method thereof | Tsung-Yuan Chen, Cheng-Pin Chien | 2011-11-01 |
| 7999195 | Circuit board having isolation cover and assembling method thereof | Chung-Shao Huang, Ching-Feng Hsieh, Jen-Huan Yu, Cheng-Wen Dai | 2011-08-16 |
| 7958625 | Assembly device | Chia-Hung Lee, Jen-Huan Yu, Chung-Shao Huang, Ching-Feng Hsieh, Cheng-Wen Dai | 2011-06-14 |