Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7918021 | Production of via hole in a flexible printed circuit board by applying a laser or punch | Ryuichiro Kogure, Hiroaki Yamaguchi, Osamu Nakayama | 2011-04-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7918021 | Production of via hole in a flexible printed circuit board by applying a laser or punch | Ryuichiro Kogure, Hiroaki Yamaguchi, Osamu Nakayama | 2011-04-05 |