Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080121 | Method of bonding, thinning, and releasing wafer | — | 2011-12-20 |
| 8080123 | Supporting plate, apparatus and method for stripping supporting plate | Akihiko Nakamura, Atsushi Miyanari | 2011-12-20 |
| 7999052 | Process for producing an adhesive composition | Takahiro Asai, Koichi Misumi, Atsushi Miyanari, Akihiko Nakamura, Koji Saito | 2011-08-16 |
| 7919394 | Method for thinning substrate and method for manufacturing circuit device | Akihiko Nakamura, Atsushi Miyanari | 2011-04-05 |