Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8075721 | Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability | Chew B. Chan, Hwang Kyu Yun, Renzhe Zhao, Weitong Shi | 2011-12-13 |