Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008183 | Dual capillary IC wirebonding | Rex W. Pirkle, David J. Bon | 2011-08-30 |
| 7884449 | Process for precision placement of integrated circuit overcoat material | Rex W. Pirkle | 2011-02-08 |