Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030137 | Flexible interposer for stacking semiconductor chips and connecting same to substrate | — | 2011-10-04 |
| 7928550 | Flexible interposer for stacking semiconductor chips and connecting same to substrate | — | 2011-04-19 |
| 7872841 | In package ESD protections of IC using a thin film polymer | Yves Leduc, Nathalie Messina, Charvaka Duvvury | 2011-01-18 |