Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939939 | Stable gold bump solder connections | Kejun Zeng, Wei Qun Peng, Rebecca L. Holford, Robert John Furtaw | 2011-05-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7939939 | Stable gold bump solder connections | Kejun Zeng, Wei Qun Peng, Rebecca L. Holford, Robert John Furtaw | 2011-05-10 |