Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084357 | Method for manufacturing a dual damascene opening comprising a trench opening and a via opening | Wei-Chih Chen, Feng-Yu Hsu, Chun-Chieh Huang, Mei-Ling Chen, Jiann-Jen Chiou | 2011-12-27 |
| 7947565 | Forming method of porous low-k layer and interconnect process | Mei-Ling Chen, Kuo-Chih Lai, Chien-Chung Huang, Yu-Tsung Lai | 2011-05-24 |