MY

Ming-Chih Yew

AT Advanced Chip Engineering Technology: 1 patents #3 of 13Top 25%
📍 Hsinchu, MI: #4 of 5 inventorsTop 80%
Overall (2011): #209,779 of 364,097Top 60%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7884464 3D electronic packaging structure having a conductive support substrate Chang Yuan, Chan-Yen Chou, Kou-Ning Chiang 2011-02-08