Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884471 | Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same | Yu-Ying Tsai, Shih-Ming Chen | 2011-02-08 |
KL
Kuo-Wei Lin
Overall (2011): #239,129 of 364,097Top 70%
1
Patents 2011