Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053336 | Method for reducing chip warpage | Ting-Hau Wu, Jiou-Kang Lee, Shang-Ying Tsai, Jung-Huei Peng | 2011-11-08 |
| 8053377 | Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same | Shang-Ying Tsai, Jiou-Kang Lee, Jung-Huei Peng, Ting-Hau Wu | 2011-11-08 |
| 7998775 | Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures | Shang-Ying Tsai, Jung-Huei Peng, Jiou-Kang Lee, Ting-Hau Wu | 2011-08-16 |
| 7999257 | Process for eliminating delamination between amorphous silicon layers | Jiou-Kang Lee, Shang-Ying Tsai, Ting-Hau Wu, Hsiang-Fu Chen | 2011-08-16 |
| 7923379 | Multi-step process for forming high-aspect-ratio holes for MEMS devices | Jiou-Kang Lee, Ting-Hau Wu, Shang-Ying Tsai, Jung-Huei Peng | 2011-04-12 |