Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018032 | Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip | — | 2011-09-13 |
| 7918791 | Optical scanning probe | Chia-Wei Sun, Gwo-Bin Lee, Te-Yang Shen | 2011-04-05 |
| 7888157 | Image sensor chip package method | — | 2011-02-15 |