Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8013451 | Interconnect structure to reduce stress induced voiding effect | — | 2011-09-06 |
| 7893459 | Seal ring structures with reduced moisture-induced reliability degradation | Jian-Hong Lin | 2011-02-22 |