Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039305 | Method for bonding semiconductor wafers and method for manufacturing semiconductor device | Kenzou Mejima, Satoru Katsurayama | 2011-10-18 |
| 8034651 | Light receiving device and method of manufacturing light receiving device | Toyosei Takahashi, Rie Takayama, Masakazu Kawata | 2011-10-11 |