Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008767 | Semiconductor device | Masahiro Wada, Hiroyuki Tanaka, Hiroshi Hirose, Teppei Itoh | 2011-08-30 |
| 7893542 | Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board | Masahiro Wada, Takuya Hatao | 2011-02-22 |