Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003496 | Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die | JiHoon Oh, SinJae Lee | 2011-08-23 |
| 8004093 | Integrated circuit package stacking system | JiHoon Oh, Jaehyun LIM, SunYoung Chun, KyuWon Lee, SinJae Lee +1 more | 2011-08-23 |