Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7892861 | Method for fabricating a compound-material wafer | Willy Michel, Patrick Reynaud, Walter Schwarzenbach | 2011-02-22 |
| 7883628 | Method of reducing the surface roughness of a semiconductor wafer | Eric Neyret, Emmanuel Arene | 2011-02-08 |