Issued Patents 2011
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8083115 | Substrate cutting device and method | Fabrice Letertre | 2011-12-27 |
| 8012289 | Method of fabricating a release substrate | Takeshi Akatsu | 2011-09-06 |
| 7972939 | Transfer method with a treatment of a surface to be bonded | Sebastien Kerdiles, Christophe Maleville, Fabrice Letertre | 2011-07-05 |
| 7939428 | Methods for making substrates and substrates formed therefrom | Alice Boussagol, Bruce Faure, Bruno Ghyselen, Fabrice Letertre | 2011-05-10 |
| 7902038 | Detachable substrate with controlled mechanical strength and method of producing same | Bernard Aspar, Hubert Moriceau, Bruno Ghyselen | 2011-03-08 |
| 7892946 | Device and method for cutting an assembly | Fabrice Letertre | 2011-02-22 |
| 7888235 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Fabrice Letertre, Bruno Ghyselen | 2011-02-15 |