Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053879 | Stacked semiconductor package and method for fabricating the same | Qwan Ho CHUNG | 2011-11-08 |
| 7880093 | 3-dimensional substrate for embodying multi-packages and method of fabricating the same | — | 2011-02-01 |