Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7948043 | MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads | Dong Joon Kim | 2011-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7948043 | MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads | Dong Joon Kim | 2011-05-24 |