Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8049341 | Semiconductor package and method for manufacturing the same | Seung Taek YANG, Seung Hyun Lee, Jong Hoon Kim | 2011-11-01 |
| 8018043 | Semiconductor package having side walls and method for manufacturing the same | Seung Taek YANG, Seung Hyun Lee, Jong Hoon Kim | 2011-09-13 |
| 7973414 | Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same | — | 2011-07-05 |
| 7923294 | Semiconductor package and method for manufacturing the same for decreasing number of processes | — | 2011-04-12 |
| 7911065 | Semiconductor package having a stacked wafer level package and method for fabricating the same | — | 2011-03-22 |
| 7871925 | Stack package and method for manufacturing the same | Sung Min Kim | 2011-01-18 |