Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8044516 | Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same | — | 2011-10-25 |
| 7989264 | Warpage resistant semiconductor package and method for manufacturing the same | — | 2011-08-02 |
| 7898834 | Semiconductor chip with chip selection structure and stacked semiconductor package having the same | Sung Min Kim, Kwon Whan Han, Seong Cheol Kim, Ha Na Lee | 2011-03-01 |