Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985629 | Resin sealing method of semiconductor device | — | 2011-07-26 |
| 7928557 | Stacked package and method for manufacturing the package | Kiyoshi Oi | 2011-04-19 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985629 | Resin sealing method of semiconductor device | — | 2011-07-26 |
| 7928557 | Stacked package and method for manufacturing the package | Kiyoshi Oi | 2011-04-19 |