Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053680 | Wiring board having efficiently arranged pads | Yasue Tokutake, Naoyuki Koizumi, Shigeaki Suganuma, Michio Horiuchi | 2011-11-08 |
| 8017503 | Manufacturing method of semiconductor package | Kiyoshi Oi, Toru Hizume, Akihiko Tateiwa | 2011-09-13 |
| 7939377 | Method of manufacturing semiconductor element mounted wiring board | Akihiko Tateiwa | 2011-05-10 |