Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7934634 | Wire bonding method | Tishihiko Toyama, Shinsuke Tei | 2011-05-03 |
| 7910472 | Method of manufacturing semiconductor device | Toshihiko Toyama, Hiroaki Yoshino | 2011-03-22 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7934634 | Wire bonding method | Tishihiko Toyama, Shinsuke Tei | 2011-05-03 |
| 7910472 | Method of manufacturing semiconductor device | Toshihiko Toyama, Hiroaki Yoshino | 2011-03-22 |