Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7923904 | Electronic package having stress buffer layer on mounting surface thereof, and method for manufacturing same | Hitoshi Takeuchi, Kiyoshi Aratake, Masashi Numata | 2011-04-12 |
| 7906429 | Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof | Toru Takayama, Shunpei Yamazaki | 2011-03-15 |