Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7929248 | Top bond pad for transducing head interconnect | Jianxin Zhu, David Allen Sluzewski, Lance E. Stover, Joel William Hoehn | 2011-04-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7929248 | Top bond pad for transducing head interconnect | Jianxin Zhu, David Allen Sluzewski, Lance E. Stover, Joel William Hoehn | 2011-04-19 |