Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8052505 | Wafer processing method for processing wafer having bumps formed thereon | Hajime Akahori | 2011-11-08 |
| 8052824 | Film peeling method and film peeling device | — | 2011-11-08 |
| 7915875 | Current-mode controlled DC-DC converter | Hideki Asuke, Hideharu Takano, Mamoru Tsuruya, Masayoshi Yamamoto, Hiroyuki Horii +1 more | 2011-03-29 |
| 7880222 | Semiconductor device having plural regions and elements with varying areas depending on the region | Katsuyuki Torii | 2011-02-01 |