Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8043896 | Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package including an inclined via hole | Yun Hwi Park | 2011-10-25 |
| 7872869 | Electronic chip module | Yun Hwi Park | 2011-01-18 |