SH

Sungmin Hong

SC Stats Chippac: 1 patents #96 of 188Top 55%
Overall (2011): #157,003 of 364,097Top 45%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7915084 Method for making a stacked package semiconductor module having packages stacked in a cavity in the module substrate 2011-03-29