Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888772 | Electronic fuse having heat spreading structure | Dae-Jin Kwon, Woo-Sik Kim, Maeda Shigenobu, Seung Hwan Lee, Wang-Xiao Quan +1 more | 2011-02-15 |
| 7863152 | Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure | Seung Hwan Lee, Heon-Jong Shin, Shigenobu Maeda, Quan WangXiao, Hyun Choi | 2011-01-04 |