Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7879720 | Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation | Woo Jin Jang, Hyung Woo Kim, Bum Ki Moon | 2011-02-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7879720 | Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation | Woo Jin Jang, Hyung Woo Kim, Bum Ki Moon | 2011-02-01 |